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  1/8 tda7535 december 2003 n 20-bit resolution single ended output n analog reconstruction third order chebyshev filter n i 2 s input data format n on chip pll n system clock: 64 fs n 2 output channels n 0.9 vrms single ended output dynamic n 3.3v power supply n reset n sampling rate 36khz to 48khz description the tda7535 is a stereo, digital-to-analog converter designed for audio application, including digital inter- polation filter, a third order multibit delta-sigma dac, a third order chebyshev's reconstruction filter and a differential to single ended output converter. this de- vice is fabricated in highly advanced cmos, where high speed precision analog circuits are combined with high density logic circuits. the tda7535, ac- cording to standard audio converters, can accept any i 2 s data format. the tda7535 is available in so-14 package. the to- tal power consumption is less than 75mw. tda7535 is suitable for a wide variety of applications where high performance are required. its low cost and single 3.3v power supply make it ideal for sever- al applications, such as cd players, mpeg audio, midi applications, cd-rom drives, cd-interactive, digital radio applications and so on. an evaluation board is available to perform measurement and to make listening tests. so-14 ordering number: tda7535 delta/sigma cascade 20 bit stereo dac block diagram fir1 fir2 alu s&h i 2 s i 2 s pll clkout digital input 20 fir3 20 4 sd modulator thermo decoder & randomizer 3rd chebyshev sc filter diff to single converter analog output f s 8f s 23 64f s d02au1417
tda7535 2/8 absolute maximum ratings warning: operation at or beyond these limit may result in permanent damage to the device. normal operation is not guaranteed at these extremes. thermal data note: 1. in still air pin connections (top view) pin function symbol parameter value unit v dd v cc power supplies digital analog -0.5 to +4.6 -0.5 to +4.6 v v v aio analog input and output voltage -0.5 to (v cc +0.5) v v dio digital input and output voltage -0.5 to (v dd +0.5) v v di5 digital input voltage (5v tolerant) -0.5 to 6.5 v t j operating junction temperature range -40 to 125 c t stg storage temperature -55 to 150 c symbol parameter value unit r th j-amb thermal resistance junction to ambient (1) 85 c/w pin number pin name input/output power description 1 n.c. - - 2 sdata i i2s digital data input 3 sck i i2s clock input 4 n.c. - - 5 gnd_dig p digital ground 6 gnd_ana p analog ground 7 outsr o right channel single ended output 8 outsl o left channel single ended output 9 vcm p reference 1.65v externally filtered 10 vdd_ana p analog 3.3v-supply 11 n.c. - - 12 vdd_dig p digital 3.3v-supply 13 fsync i i2s left-right channel selector 14 resetn i reset (active low) n.c. sdata sck n.c. gnd_dig outsr gnd_ana outsl vdd_ana vcm n.c. vdd_dig fsync resetn 1 3 2 4 5 6 7 12 11 10 9 8 13 14 d01au1276a
3/8 tda7535 recommended dc operating conditions power consumption general interface electrical characteristics note: 1. the leakage currents are generally very small, <1na. the value given here, 1ma, is the maximum that can occur after an e lectro- static stress on the pin. 2. human body model. low voltage cmos interface dc electrical characteristics symbol parameter test condition min. typ. max. unit v dd 3.3v digital power supply voltage 3.15 3.3 3.45 v v cc 3.3v analog power supply voltage 3.15 3.3 3.45 v symbol parameter test condition min. typ. max. unit i dd total maximum current power supply @ 3.3v and t j = 125c 21.5 25 ma symbol parameter test condition min. typ. max. unit l il low level input current without pullup device v i = 0v (note 1) 1 m a l ih high level input current without pullup device v i = v dd (note 1) 1 m a i latchup i/o latch-up current v < 0v, v > v dd 200 ma v esd electrostatic protection leakage , 1 m a (note 2) 2000 v symbol parameter test condition min. typ. max. unit v il low level input voltage 0.2*v dd v v ih high level input voltage 0.8*v dd v v hyst schmitt trigger hysteresis 0.8 v dac electrical characteristics vdd = 3.3v; tamb = 25c; input signal frequency = sinus wave generated by audio precision sys.2; input signal amplitude = see notes; noise integration bandwidth = 20hz to 22khz (a- weighted) parameter test condition min. typ. max. unit noise + distortion (see note 1) @0db @-6dbb @-40db @-60db 89 94 96 96 db db db db total harmonic distortion see note 2 94 db dynamic range see note 3 96 db crosstalk see note 4 -95 db full scale output voltage v dd = 3.15 to 3.45v full scale input 0.8 0.9 1.0 vrms input sampling rate 36 48 khz
tda7535 4/8 note1: it is the ratio between the maximum input signal and the integration of the in-band noise after deducing the power of sig nal funda- mental. it depends on the input signal amplitude. in this case 0db means full scale digital, 1khz frequency used. note 2: it is the ratio of the rms value of the signal fundamental component at 0db (full scale digital) to the rms value of all of the harmonic components in the band. note 3: measured using the snr at -60db input signal, with 60db added to compensate for small input signal. note 4: left channel on with 0db/1khz input signal, right channel on with dc input signal. figure 1. i 2 s interface diagram passband ripple 0.12 db stopband @ 3db @ 90db 44.1khz sampling rate 21.53 24.80 khz interchannel gain mismatch 0.05 0.1 db dac electrical characteristics (continued) vdd = 3.3v; tamb = 25c; input signal frequency = sinus wave generated by audio precision sys.2; input signal amplitude = see notes; noise integration bandwidth = 20hz to 22khz (a- weighted) parameter test condition min. typ. max. unit fsync sdata sck 32 * sck 32 * sck 20 bits msb lsb 20 bits msb lsb left right
5/8 tda7535 figure 2. i 2 s timings (1) sck clock defines the fs, being the sample rate. this input clock needs a jitter below ~212ps rms (2) fsync switches inside the time window as specified w.r.t. to falling edge of sck figure 3. power up & reset sequence i 2 s bit clock (sck) must be present 20ms before reset release to allow pll locking. timing description minimum maximum unit t sck clock cycle (1) 1/(64*fs) - 150ps rms 1/(64*fs) + 150ps rms ns t sckpl sck phase low 0.5*t sck - 1% 0.5*t sck +1% ns t sckph sck phase high 0.5*t sck - 1% 0.5*t sck +1% ns t lrw- fsync switching time window before sck falling edge (2) 0 0.125*t sck -10 ns t lrw+ fsync switching time window after sck falling edge (2) 0 0.125*t sck -10 ns t sds sdata setup time 60 ns t sdh sdata hold time 30 ns t sckr sck rise time 1.5 ns t sckf sck fall time 1.5 ns t sck t sckpl t sds t lrw- t sckph t lrw+ t sdh valid fsync sdata sck valid t sckf t sckr t res t res min 50ms v dd reset d02au1418
tda7535 6/8 figure 4. frequency response figure 5. 10 m h bead inductor sdata 7 tp1 tp7 j4 bnc j3 bnc tp8 2 outsr sck tp2 3 fsync i 2 s tp3 13 gnd_dig 5 gnd_ana vcm 6 9 8 tp5 +3.3vana +3.3 vdig m p r2 10k 100nf(*) 100nf(*) c15 47 m f 10v (*) c7 10 m f 10v 10 m f 10 m f sw1 c16 100nf (*) tp6 outsl 10 vdd_ana 12 vdd_dig resetn outsr outsl 14 d02au1419b u4 (*) as close as possible to the pin
7/8 tda7535 outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 1.35 1.75 0.053 0.069 a1 0.10 0.30 0.004 0.012 a2 1.10 1.65 0.043 0.065 b 0.33 0.51 0.013 0.020 c 0.19 0.25 0.007 0.01 d (1) 8.55 8.75 0.337 0.344 e 3.80 4.0 0.150 0.157 e 1.27 0.050 h 5.8 6.20 0.228 0.244 h 0.25 0.50 0.01 0.02 l 0.40 1.27 0.016 0.050 k 0? (min.), 8? (max.) ddd 0.10 0.004 (1) d dimension does not include mold flash, protusions or gate burrs. mold flash, protusions or gate burrs shall not exceed 0.15mm per side. so14 0016019 d
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2003 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com 8/8 tda7535


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